Gyeonggi Province Hosts '2026 Next-Generation Semiconductor Packaging Industry Exhibition (ASPS)'

Gyeonggi Province is recruiting visitors for the '2026 Next-Generation Semiconductor Packaging Industry Exhibition (ASPS)' to be held at Suwon Convention Center for three days starting on the 26th.

The 'Next-Generation Semiconductor Packaging Industry Exhibition,' now in its fourth year since 2023, is a local government-led specialized semiconductor packaging exhibition where the latest technologies and industry trends in advanced semiconductor packaging and chiplets can be viewed in one place. Semiconductor packaging and chiplets refer to core post-processing technologies and designs for continuously improving semiconductor performance.

This year's event will be held with 400 booths featuring 180 domestic and foreign companies and organizations. Semiconductor companies including Samsung Electronics and SK Hynix, as well as major semiconductor industry hub local governments such as Gyeonggi Province, Suwon, Hwaseong, Yongin, and Icheon will participate.

In particular, Gyeonggi Province Governor Choo Mi-ae will attend the opening ceremony to announce Gyeonggi Province's commitment and direction of corporate support for securing K-semiconductor competitive advantage through innovation in advanced semiconductor packaging industry.

During the exhibition period, various related events will be held including △next-generation semiconductor packaging industry exhibition △semiconductor packaging trend forum (SPTF) △SBJ small and medium supplier technology convergence forum symposium △participating company technology seminars △domestic and overseas buyer export and purchasing consultation meetings △semiconductor recruitment fair △buyer docent tours and more.

Following last year, this event will be co-hosted with the 'International Semiconductor Executive Summit (ISIG Executive Summit Korea) 2026' with the participation of approximately 150 senior executives from global semiconductor companies, further strengthening the scale and status of the international event. Plans are in place to gradually expand its role as a global business platform for exchange between domestic and overseas semiconductor companies and experts.

Park Min-kyung, Director of the Semiconductor Industry Division, stated, "Advanced packaging is a core technology that determines the competitiveness of artificial intelligence and high-performance semiconductors," adding, "We hope this exhibition will serve as a practical venue for exchange to strengthen the technological competitiveness of semiconductor companies in the province, open up sales channels, and expand cooperation with global companies."

Those wishing to visit the exhibition can enter for free by pre-registering on the official website of the '2026 Next-Generation Semiconductor Packaging Industry Exhibition' (www.semipkgshow.com) by August 25th. (On-site registration: 10,000 won)